Learn what makes UHDI different from HDI and explore its applications in smartphones, 5G equipment, medical devices, aerospace, and IoT.
Understand the challenges of line widths below 25 microns (1 mil) and the evolution from HDI to UHDI for increasing functionality on smaller footprints.
Explore microvias, stacked vias, and via-in-pad technologies in UHDI PCB design.
Take a facility tour to identify UHDI-specific boards and manufacturing techniques, and study real-world case studies of UHDI designs.
- High-frequency materials: Rogers, Taconic, and Isola - Ultra-thin copper foils and flexible laminates
- Use of embedded components and integrated passives - Multilayer stack-ups with controlled impedance - Managing signal integrity challenges in UHDI
- Use of copper pillars for heat dissipation - Graphene and other advanced thermal materials - CAD software with UHDI-specific templates (Altium, Mentor Graphics)
Advanced laser drilling (UV and COâ‚‚ hybrid systems), stacked and staggered via configurations, and via-in-pad techniques for increased density.
Ultra-thin copper deposition and plating for 1-mil traces and sub-mil spaces.
LDI (Laser Direct Imaging) techniques for fine lines and tight tolerances, and techniques to avoid solder mask creep.
Embedded components for system-on-board (SoB) designs, UHDI integration with chip-scale packaging (CSP), and 3D printed circuits and additive manufacturing.
Flying probe testing with ultra-fine pitch capabilities and Time Domain Reflectometry (TDR) for signal integrity validation.
AOI setup for 1-mil line and space resolution and X-ray inspection for buried vias and stacked microvias.
Thermal shock and aging tests, and high-frequency performance tests. IPC Standards for UHDI: IPC-6012 and IPC-2226 standards.
Process streamlining for high yields in UHDI manufacturing and root cause analysis and corrective actions (RCA/CA).
Optimizing machine utilization for fine-pitch components and proactive maintenance for laser drilling and plating machines.
Mitigating common UHDI defects (via voids, misaligned traces) and use of AI and machine learning for predictive maintenance.
Tracking raw materials and components with blockchain and counterfeit component mitigation.
Design a functional UHDI PCB with embedded components and microvias, manufacture the board using advanced processes, perform signal integrity tests and AOI inspections, and document design challenges, process improvements, and defect mitigation.
Written Exam: Comprehensive assessment of all modules. Practical Test: Inspection and testing of UHDI boards. Capstone Presentation: Showcase project results to instructors and peers.
Earn your certification in UHDI PCB manufacturing and placement support upon successful completion of the capstone project and assessments.
Direct connections with industry partners in UHDI manufacturing
Membership to the advanced PCB innovation center
Access to webinars, workshops, and networking events with industry experts
Master the technical and operational processes for UHDI PCB manufacturing.
Gain expertise in advanced laser drilling, copper plating, and signal integrity testing.
Understand process optimization techniques to increase yields and minimize defects.
Be prepared for careers in UHDI PCB manufacturing with access to job placement support and innovation resources.
Master the art of UHDI PCB manufacturing in our comprehensive 14-week program, combining in-person lectures, hands-on labs, and industry visits.