MODULE 1: Introduction to UHDI Technology and Industry Applications
1
Definition and Applications
Learn what makes UHDI different from HDI and explore its applications in smartphones, 5G equipment, medical devices, aerospace, and IoT.
2
Miniaturization Trends
Understand the challenges of line widths below 25 microns (1 mil) and the evolution from HDI to UHDI for increasing functionality on smaller footprints.
3
PCB Design Architectures
Explore microvias, stacked vias, and via-in-pad technologies in UHDI PCB design.
4
Practical Experience
Take a facility tour to identify UHDI-specific boards and manufacturing techniques, and study real-world case studies of UHDI designs.
MODULE 2: UHDI Materials and Advanced Stack-Up Design
Materials for UHDI Boards
- High-frequency materials: Rogers, Taconic, and Isola - Ultra-thin copper foils and flexible laminates
Stack-up Design Techniques
- Use of embedded components and integrated passives - Multilayer stack-ups with controlled impedance - Managing signal integrity challenges in UHDI
Thermal Management and Design Tools
- Use of copper pillars for heat dissipation - Graphene and other advanced thermal materials - CAD software with UHDI-specific templates (Altium, Mentor Graphics)
MODULE 3: UHDI Manufacturing Technologies
1
Microvia Formation
Advanced laser drilling (UV and CO₂ hybrid systems), stacked and staggered via configurations, and via-in-pad techniques for increased density.
2
Copper Via Fill Plating
Ultra-thin copper deposition and plating for 1-mil traces and sub-mil spaces.
3
Solder Mask Application
LDI (Laser Direct Imaging) techniques for fine lines and tight tolerances, and techniques to avoid solder mask creep.
4
Advanced Packaging Techniques
Embedded components for system-on-board (SoB) designs, UHDI integration with chip-scale packaging (CSP), and 3D printed circuits and additive manufacturing.
MODULE 4: Quality Control and Reliability Testing for UHDI Boards
Electrical Testing for UHDI Boards
Flying probe testing with ultra-fine pitch capabilities and Time Domain Reflectometry (TDR) for signal integrity validation.
Optical and X-Ray Inspection
AOI setup for 1-mil line and space resolution and X-ray inspection for buried vias and stacked microvias.
Environmental and Thermal Stress Testing
Thermal shock and aging tests, and high-frequency performance tests. IPC Standards for UHDI: IPC-6012 and IPC-2226 standards.
MODULE 5: Process Optimization and Manufacturing Scalability
1
Lean and Six Sigma for UHDI Production
Process streamlining for high yields in UHDI manufacturing and root cause analysis and corrective actions (RCA/CA).
2
OEE and TPM Implementation
Optimizing machine utilization for fine-pitch components and proactive maintenance for laser drilling and plating machines.
3
Yield Optimization
Mitigating common UHDI defects (via voids, misaligned traces) and use of AI and machine learning for predictive maintenance.
4
Blockchain-based Supply Chain Traceability
Tracking raw materials and components with blockchain and counterfeit component mitigation.
MODULE 6: Capstone Project and Certification
1
Project Requirements
Design a functional UHDI PCB with embedded components and microvias, manufacture the board using advanced processes, perform signal integrity tests and AOI inspections, and document design challenges, process improvements, and defect mitigation.
2
Assessment and Presentation
Written Exam: Comprehensive assessment of all modules. Practical Test: Inspection and testing of UHDI boards. Capstone Presentation: Showcase project results to instructors and peers.
3
Certification
Earn your certification in UHDI PCB manufacturing and placement support upon successful completion of the capstone project and assessments.
Post-Graduation Support and Career Resources
Job Placement Assistance
Direct connections with industry partners in UHDI manufacturing
Innovation Center Access
Membership to the advanced PCB innovation center
Ongoing Learning
Access to webinars, workshops, and networking events with industry experts
Tools and Resources Provided
Learning Outcomes
Technical Mastery
Master the technical and operational processes for UHDI PCB manufacturing.
Advanced Expertise
Gain expertise in advanced laser drilling, copper plating, and signal integrity testing.
Process Optimization
Understand process optimization techniques to increase yields and minimize defects.
Career Readiness
Be prepared for careers in UHDI PCB manufacturing with access to job placement support and innovation resources.