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Printed Circuit Board Assembly Curriculum

This detailed curriculum is designed to guide students from the fundamentals to advanced skills in PCB assembly, focusing on both theoretical knowledge and hands-on experience. Graduates will be ready to pursue roles in PCB assembly, production management, and quality control.

Curriculum Overview
Duration and Commitment

Total Duration: 12 Weeks
Weekly Commitment: 20-30 hours

Training Locations

Practical Sessions: 2001 Landmeier Rd., Elk Grove Village
Classroom Training: 6 Executive Court, South Barrington

Phase 1: Introduction to PCB Assembly (Weeks 1-2)

This phase provides a strong foundation in PCB concepts, ensuring students understand the components, processes, and terminology of assembly.

1
Module 1: Overview of PCB Manufacturing & Assembly Process
  • Introduction to PCB Architecture (substrates, copper layers, vias, ground planes)
  • Overview of Single-sided, Double-sided, Multi-layer, and HDI PCBs
  • Comparison of Surface Mount Technology (SMT) vs. Thru-hole Technology
  • Exploration of PCB Applications in automotive, consumer electronics, telecommunications, and medical industries
2
Module 2: PCB Design & Documentation
  • Understanding Gerber Files, Bill of Materials (BOM), and Netlists
  • Basics of Electronic Design Automation (EDA) tools like Altium and KiCad
  • Overview of Design for Assembly (DFA) and Design for Manufacturing (DFM) principles
3
Practical Lab 1:
  • Familiarization with PCB design software: Generating simple PCB layouts
  • Reading circuit diagrams and assembling a simple LED circuit using thru-hole technology
Phase 2: Component Preparation & Handling (Weeks 3-4)

This phase focuses on developing competence with the components used in PCB assembly and key skills like soldering.

Module 3: Electronic Components – Types and Functions
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4
1
Passive Components

Resistors, capacitors, inductors, ferrite beads

2
Active Components

Diodes, transistors, microcontrollers, ICs

3
Connectors and Cables

Headers, sockets, plugs

4
PCB Chip Packaging Formats

BGA, QFN, SOIC, etc.

Module 4: Introduction to Soldering
  • Differences between Manual Soldering, Reflow, and Wave Soldering
  • How to select solder paste, flux, and soldering alloys
  • ESD Precautions and proper handling of sensitive components
  • Safety Protocols: Eye protection, fume extraction, and ergonomic considerations
Practical Lab 2:
  • Soldering Practice: Assembling thru-hole and SMT components
  • Inspecting joints for quality using magnification tools (microscope and loupe)
Phase 3: Advanced PCB Assembly Techniques

Students will learn about automated assembly processes and troubleshooting methods. The focus is on bridging theory with real-world applications.

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Module 5: Surface Mount Technology (SMT) Process Flow
  • Stencil Printing: How to apply solder paste accurately
  • Pick-and-Place Machines: Component placement and alignment
  • Reflow Soldering: Temperature profiles, solder paste reflow characteristics, and troubleshooting
2
Module 6: Thru-Hole Technology and Wave Soldering
  • Wave soldering machine setup and calibration
  • Process of lead trimming, pin insertion, and solder joint inspection
  • Soldering techniques for odd-shaped components
3
Module 7: Common Assembly Defects and Troubleshooting Techniques

Identification of assembly defects:

  • Tombstoning, Bridging, and Cold Joints
  • Component misalignment and polarity errors
  • Open circuits and shorts caused by improper soldering

Troubleshooting Techniques: Using digital multimeters, oscilloscopes, and power supply diagnostics

4
Practical Lab 3:
  • Assembly of Multi-layer PCB: Students will complete an advanced circuit assembly using both SMT and thru-hole components
  • Troubleshooting Exercise: Practice identifying and correcting common defects
Phase 4: Quality Control & Industry Standards (Weeks 9-10)

This phase emphasizes quality assurance, certifications, and testing protocols, critical for industrial-grade PCB production.

Module 8: Industry Standards and Certifications
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3
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IPC Standards (IPC-A-610)
2
RoHS and REACH Compliance
3
ESD Control Standards

- Overview of IPC Standards (IPC-A-610)

- Introduction to RoHS and REACH Compliance

- Electrostatic Discharge (ESD) Control Standards and their importance

Module 9: PCB Testing & Inspection Techniques
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1
Functional Testing

Confirming circuit behavior

2
Automated Optical Inspection (AOI)

Machine setup and defect detection

3
X-ray Inspection

Identifying defects in BGA packages

4
Environmental Testing

Reliability under various conditions

- Functional Testing: Confirming circuit behavior through input-output testing

- Automated Optical Inspection (AOI): Machine setup and defect detection

- X-ray Inspection: Identifying defects inside BGA packages

- Environmental Testing: Reliability testing under various conditions (temperature, humidity)

Practical Lab 4:

- Using AOI and X-ray machines for PCB inspection

- Conducting functional tests on assembled boards

Phase 5: Supply Chain & Manufacturing Management (Weeks 11-12)

Students learn to manage PCB production at a systems level, focusing on lean principles, supply chain management, and traceability.

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Module 10: Lean Manufacturing in PCB Assembly
  • Just-in-Time (JIT) Production and Kanban Systems
  • Calculating and improving Overall Equipment Effectiveness (OEE)
  • Continuous Improvement Techniques (Kaizen) for assembly lines
2
Module 11: Supply Chain and Component Management
  • Managing inventory of critical components (semiconductors, rare minerals)
  • Traceability Software: Tracking component batches and production logs
  • Mitigating the impact of global supply chain disruptions
3
Practical Lab 5:
  • Assembly Line Simulation: Students will optimize a simulated assembly line for maximum efficiency
  • Using software to track and trace PCB components through production
Capstone Project: Full PCB Assembly & Testing (Week 12)
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1
Functional Demonstration

Present working device to instructor panel

2
Defect Report

Identify faults and detail troubleshooting

3
Assembly Documentation

Complete BOM, Gerber, inspection reports

Objective: In teams, students will assemble, test, and troubleshoot a fully functional PCB device (e.g., a microcontroller-based IoT board).

Deliverables:

  • Complete assembly documentation (BOM, Gerber, inspection reports)
  • Functional Demonstration: Presenting the working device to an instructor panel
  • Defect Report: Identifying any faults and detailing the troubleshooting process
Certification & Post-Graduation Support
Completion Certificate

Program prepares students for IPC-A-610 certification

Job Placement Assistance

Introductions to job opportunities nationwide in PCB manufacturing

Innovation Center Access

Graduates receive premium membership access to the advanced PCB chip innovation center for ongoing learning and R&D opportunities

Evaluation and Grading Criteria
Program Outcomes and Career Opportunities
Skills and Expertise

Graduates will have the skills to assemble both SMT and thru-hole PCBs at an industrial level. Expertise in troubleshooting, quality control, and component management will prepare students for careers in various roles.

Career Opportunities
  • PCB Assembly Technician
  • Test Engineer
  • Quality Assurance Inspector
  • Manufacturing Manager
Essential Skills

The program builds problem-solving abilities and critical thinking skills essential for leadership roles in PCB manufacturing.

Curriculum Summary
  • This curriculum provides a deep dive into the essential skills required in PCB assembly, making it ideal for students looking to join the electronics manufacturing industry.
  • Students will gain comprehensive knowledge and hands-on experience in PCB assembly techniques, component handling, quality control, and industry standards.
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