Courses
Apply
Curriculum for PCB Manufacturing
Welcome to the PCB Boot Camp, where we offer an all-encompassing education in PCB manufacturing. Our curriculum is meticulously designed to provide students with in-depth knowledge and hands-on experience in every critical stage of the PCB production process.
Each module in our program covers essential aspects of PCB manufacturing, emphasizing practical training and industry best practices. Our goal is to equip you with the skills and expertise needed to excel in the world of PCB production.
Module 1: Introduction to PCB Design and Manufacturing

1

2

3

4

1

Design for Manufacturability
DFM considerations for high-density designs

2

Schematic Capture & PCB Layout
Introduction to design fundamentals

3

Layer Stack-up Design
Rigid, flexible, and rigid-flex boards

4

PCB Types
Single-sided, double-sided, multilayer
This module provides an Overview of PCB Technology, covering essential aspects of Printed Circuit Board design and manufacturing. Students will gain a comprehensive understanding of various PCB types, including single-sided, double-sided, and multilayer boards. The course delves into layer stack-up design, exploring rigid, flexible, and rigid-flex board configurations.
The Design Fundamentals section introduces participants to schematic capture and PCB layout techniques. A crucial focus is placed on Design for Manufacturability (DFM), with special attention given to considerations for high-density designs. This foundational knowledge prepares students for the complexities of modern PCB production.
Module 2: Material Manufacturing and Lamination

1

2

3

1

Material Preparation
Copper-clad laminates and prepreg

2

Material Properties
Handling and storage best practices

3

Lamination Process
Multilayer techniques and defect prevention
Material Preparation:
  • Overview of copper-clad laminates, prepreg materials, and their roles in PCB construction.
  • Material properties, handling, and storage best practices.
Lamination Process:
  • Techniques for multilayer lamination, including pressing, bonding, and alignment.
  • Prevention of defects such as delamination and voids during lamination.
Module 3: Drilling and Hole Formation
1
Mechanical and Laser Drilling
High-speed drilling techniques for creating through-holes, microvias, and blind/buried vias. Introduction to laser drilling for precision microvia formation, especially in HDI boards.
2
Hole Quality Control
Ensuring hole integrity by managing burrs, smear removal, and maintaining hole wall quality. Inspection techniques for drilled hole consistency and reliability.
3
Advanced Drilling Techniques
Exploration of high-speed drilling techniques for creating various types of holes in PCBs, including through-holes, microvias, and blind/buried vias. Emphasis on precision and efficiency in the drilling process.
4
Inspection and Quality Assurance
Detailed examination of inspection techniques used to ensure drilled hole consistency and reliability. Focus on maintaining hole integrity through proper management of burrs and smear removal.
Module 4: Imaging and Photolithography

1

Imaging Process Fundamentals
The imaging process in PCB manufacturing relies on photolithography, a crucial technique that involves:
  • Photoresist application
  • Pattern transfer
  • Exposing, developing, and etching precise circuit patterns

2

Direct Imaging (DI) Technology
Advanced imaging techniques are essential for high-density and fine-line circuit patterning. This technology focuses on:
  • Handling tight tolerances
  • Achieving accurate resolution for complex designs

3

Precision and Complexity
The imaging and photolithography process is critical for creating intricate circuit patterns. It requires a deep understanding of:
  • Photoresist properties and behavior
  • Exposure techniques
  • Etching processes for various materials
Module 5: Electroless Plating and Dry Film Lamination

1

Electroless Copper Plating
This process involves the chemistry and process control for reliable copper deposition on non-conductive surfaces. It's crucial for creating robust conductive pathways through vias and inner layers of PCBs.

2

Chemistry and Process Control
Mastering the chemistry and process control is essential for reliable copper deposition on non-conductive surfaces. This ensures a consistent and high-quality plating result across the entire PCB.

3

Conductive Pathways
The electroless plating process is vital for creating robust conductive pathways through vias and inner layers. This step ensures proper electrical connectivity throughout the PCB structure.

4

Dry Film Lamination
This stage involves the application and curing of dry film photoresist for circuit patterning. It's critical to ensure uniform coverage and adhesion during lamination for defect-free imaging.

5

Uniform Coverage and Adhesion
Ensuring uniform coverage and adhesion during the dry film lamination process is crucial. This step is key to achieving defect-free imaging in subsequent PCB manufacturing stages.
Module 6: Electroplating and Surface Finishing
1
Electroplating Processes
  • Techniques for copper electroplating, focusing on bath chemistry and thickness control
  • The role of additives in achieving uniform, high-quality deposits
2
Surface Finish Options
Detailed study of common surface finishes:
  • ENIG (Electroless Nickel Immersion Gold): High-reliability finish for solderability and long-term durability
  • HAL (Hot Air Leveling): Leaded and lead-free options for general PCB applications
  • OSP (Organic Solderability Preservative): Cost-effective solution for preserving copper pads
3
Selection Criteria
Selection criteria for finishes based on performance, cost, and application needs
Module 7: Via Filling, Planarization, and Copper Via Plugging

1

2

3

1

Via Filling
Conductive and non-conductive fills

2

Planarization
Mechanical and chemical methods

3

Copper Via Plugging
Solid, reliable interconnects
This module covers essential techniques in advanced PCB manufacturing:
Via Filling Techniques
We introduce via filling processes, including conductive and non-conductive fills. Students will learn about the applications for filled vias in improving signal integrity and reliability in HDI boards.
Planarization Processes
The course explores planarization techniques to ensure a flat and even surface after via filling, which is critical for advanced surface finishes. We cover mechanical and chemical planarization methods to achieve smooth finishes for reliable component placement.
Copper Via Plugging
Students will gain an understanding of the copper via plugging process for creating solid, reliable interconnects in multilayer PCBs. We'll discuss the benefits of copper-filled vias in enhancing thermal management, mechanical strength, and electrical performance.
Module 8: Routing and Scoring Techniques

1

2

3

1

Precision Routing
Maintaining board integrity

2

Mechanical Routing
Profiling PCBs

3

V-Scoring
Controlled depanelization
Mechanical Routing:
  • Methods for profiling PCBs using mechanical routers, including strategies for complex contours.
  • Precision routing for maintaining board integrity and panelization.
V-Scoring and Depanelization:
  • Techniques for V-scoring and controlling depth and angle for easy depanelization.
  • Understanding the stress impact and how to minimize mechanical damage during board separation.
Module 9: Automated Optical Inspection (AOI) and Quality Control

1

2

3

4

1

AOI Systems
Automated defect detection

2

Advanced Techniques
X-ray inspection

3

Testing
Electrical testing

4

Defect Analysis
Root cause analysis
AOI Systems: This module covers automated inspection for defect detection in circuit patterns, solder masks, and component alignment. Students will learn about advanced inspection techniques, including x-ray inspection for internal layer connections.
Testing and Defect Analysis: The course delves into electrical testing and root cause analysis for identifying and resolving common manufacturing defects. This comprehensive approach ensures students gain practical skills in quality control and defect resolution in PCB manufacturing.
Module 10: Final Finishing and Assembly Preparation

1

Solder Mask Application
Techniques for applying solder masks, including liquid photoimageable (LPI) masks for precise coverage. This step ensures accurate protection of the PCB surface.

2

Solder Mask Curing and Inspection
Curing and inspecting solder masks to ensure quality for component placement and soldering. This process guarantees the integrity of the protective layer.

3

Silkscreen Printing
Application of silkscreen legends for component identification, branding, and technical markings. This step adds crucial visual information to the PCB.

4

Silkscreen Quality Assurance
Techniques to ensure clarity and durability of silkscreen printing during assembly and throughout the product life. This final step ensures long-lasting legibility of PCB markings.
Module 11: Industry Standards and Compliance

1

2

3

1

Certification
Sector-specific processes

2

Regulatory Compliance
IPC, ISO, UL standards

3

Environmental Regulations
RoHS, REACH guidelines
Regulatory Compliance:
  • Overview of IPC, ISO, and UL standards critical to PCB quality and reliability.
  • Understanding certification processes for sectors such as automotive, aerospace, and medical devices.
Environmental and Safety Regulations:
  • Compliance with RoHS, REACH, and other environmental guidelines in material selection and waste management.
Module 12: Capstone Project
1
Real-World PCB Manufacturing Project
Students will embark on a comprehensive project to design, fabricate, and test a fully functional PCB. This hands-on experience will incorporate all the skills learned throughout the program, providing a practical application of their knowledge.
2
Industry Standards and Manufacturability
The capstone project places strong emphasis on meeting industry standards and optimizing manufacturability. Students will apply best practices to ensure their PCB designs are not only functional but also align with real-world manufacturing requirements.
3
Project Presentation
Upon completion, students will prepare and deliver final presentations. These presentations will demonstrate their design choices, problem-solving approaches, and technical decisions made throughout the project lifecycle.
4
Peer Review
As part of the learning process, students will engage in peer review sessions. This collaborative approach allows for constructive feedback and knowledge sharing among participants, further enhancing their understanding of PCB design and manufacturing principles.
Additional Program Highlights
Guest Lectures and Industry Panels
Gain insights from industry experts on emerging technologies and trends in PCB manufacturing.
Facility Tours and Industry Visits
Experience real-world operations through visits to advanced PCB manufacturing facilities within the Chicago area.
Networking and Career Support
Access industry events, job placement assistance, and networking opportunities with professionals in quantum computing, chip innovation, and electronics manufacturing.
This enhanced curriculum ensures that students acquire not only technical expertise but also an understanding of industry trends and advanced manufacturing techniques. Graduates of this program will be fully prepared to step into key roles within the PCB manufacturing industry, backed by both practical experience and a strong network of industry connections.