Curriculum in PCB IC Substrate Manufacturing

Curriculum in PCB IC Substrate Manufacturing
Equip yourself with advanced knowledge and practical skills for manufacturing IC substrates used in cutting-edge semiconductors.
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Program Structure
1
Phase 1 (1 Month)
Fundamentals of IC Substrate Design and Applications
2
Phase 2 (1 Month)
Materials and Manufacturing Technologies
3
Phase 3 (1 Month)
Advanced Manufacturing Processes and Automation
4
Capstone Project
Real-World IC Substrate Manufacturing and Testing
Curriculum Outline: Phase 1
Overview of IC Substrates
Role of IC substrates in semiconductors
Applications: AI processors, smartphones, automotive sensors, and 5G networks
Differences between PCBs and IC substrates
Design Principles for IC Substrates
High-density interconnects (HDI) with microvias
Ultra-fine line design (<5 µm line width)
CAD tools for IC substrates (Cadence, Mentor Graphics, Altium)
Managing Signal Integrity
Techniques to minimize crosstalk and impedance mismatches in high-speed circuits
Curriculum Outline: Phase 2
Materials for IC Substrates
BT resin, Ajinomoto Build-up Film (ABF), and ultra-thin copper foils
Low-loss dielectrics for high-frequency applications
Thermal management techniques to prevent warping
Photolithography for IC Substrates
UV laser direct imaging (LDI) for sub-5 µm accuracy
Use of advanced photoresists to create ultra-fine patterns
Microvia Drilling and Stacking
Laser drilling techniques for sub-30 µm vias
Via-in-pad (VIP) and stacked vias for compact designs
Curriculum Outline: Phase 3
1
Electroplating and Metallization
Copper plating techniques for ultra-thin traces and controlling plating uniformity for HDI circuits
2
Surface Finishes for IC Substrates
ENIG (Electroless Nickel Immersion Gold) and OSP (Organic Solderability Preservative), and solder mask application for high-frequency circuits
3
Automated Process Control and Industry 4.0
Introduction to process monitoring with IoT sensors and AI analytics, and automation for yield optimization and defect management
Capstone Project: Real-World IC Substrate Manufacturing and Testing
Project Description
Students will collaborate in teams to design, manufacture, and test a functional IC substrate. This project will mimic real-world scenarios, including material selection, process control, and final testing for signal integrity.
Deliverables
Completed IC substrate prototype with documentation of the manufacturing process. A presentation highlighting challenges faced, solutions applied, and testing results.
Learning Outcome
Students will apply their knowledge and skills to create a working IC substrate, gaining experience with the full product lifecycle from design to testing.
Quality Control and Testing
AOI (Automated Optical Inspection)
Advanced optical inspection techniques for detecting surface defects
X-ray Inspection
Inspection for buried vias and stacked vias in multi-layer substrates
Signal Integrity Testing
Testing for high-frequency circuits to ensure optimal performance
Thermal Analysis
Thermal cycling and warpage analysis for substrate reliability
Post-Graduation Support and Certification
1
Certification
Graduates will receive an IC Substrate Manufacturing Certificate.
2
Job Placement Assistance
Introductions to industry leaders and access to premium job placement services.
3
Advanced Access
Post-graduation access to the advanced PCB chip innovation center for further research.
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